RF Development board layout questions
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I was looking at the development board layout for the MMZ09312B and I had a few questions: datasheet: http://cache.freescale.com/files/rf_if/doc/data_sheet/MMZ09312B.pdf Are large polygon pours away from the signal path a good practice? For example in the test circuit the top left and right corners are polygon pours of the signals at pins 3 and 7 respectively which are far away. Doesn't all this extra copper end up picking up a bunch of noise (even if there is via stitching)? Since I want the traces of my input signal and output signal to have the same impedance as the SMA connectors (50 Ohms characteristic impedance) the trace width will depend on the distance between the signal layer and the ground layer among other parameters. With a standard 2 layer board (distance between layers approx...